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Printed Circuit Board (PCB)
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to tough, resilient, abrasion resistant surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional heat acceleration after solvent flash-off
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low Viscosity enhances flow and fill in narrow gaps and spaces
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Heat cure
- Good thermal conductivity values
- No added solvents
- One-part - No mixing of separate components required
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Heat flow away from PCB systems components can increase reliability
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- 1-1 mix ratio
- Highly fluent
- Self-leveling
- Versatile cure processing controlled by temperature
- Provides heat flow away from circuitry components can increase reliability
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- No added solvents
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SYLGARD™ 527 A&B Silicone Dielectric Gel
- Seals and protects PCBs and electronic devices
- Used for delicate electrical devices
- Offers excellent flexibility
- Cures even at room temperature
- Isolate circuits from harmful effects
- Special class of encapsulants
- Polymerizes into an extremely soft material
- Protects circuits and interconnections
- Operational over a wide temperature range
