DOWSIL™
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DOWSIL™ SE 9184 RTV Adhesive
- Fast tack-free RT cure
- Non-flowing
- Enhanced thermal conductivity
- Controlled silicone volatility
- No mixing required
- Room temperature cure, no ovens required
- Faster in line processing at RT with option for heat acceleration
- Can be considered for uses requiring added flame resistance and thermal dissipation
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DOWSIL™ SE 9189 L RTV
- Fast tack free, room temperature cure
- Flowable
- Cures to soft, low stress elastomer
- Controlled silicone volatility
- No added solvents
- Room temperature cure, no ovens required
- Faster in-line processing at room temperature with option for mild heat acceleration
- Soft coating can improve reliability against stress
- Can be considered for uses requiring flame resistance
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
