Home »
Dowsil Adhesives
Showing 1–20 of 34 results
Filters
-
DOWSIL™ 1200 OS Primer
- Improves adhesion of silicone sealants to many substrates
- Provides more uniform and stronger bonds
- Conforms to South Coast and Bay Air Quality Management District Regulations for architectural sealant primers
- Architectural sealant primers
- Low VOC at 76 g/l
- Formulated for low toxicity
- OS solvent used does not deplete the ozone layer OS = Ozone Safe
- Primer is suitable for weathersealing and structural glazing applications
-
DOWSIL™ 3-8219 RF Silicone Foam
- Medium hardness (Shore 00)
- Reduced flow aids application to inclined surfaces
- Easy to handle
- 1:1 mix ratio
- Fast ambient temperature cure
- No need for temporary storage of equipped parts
- equipped parts
- Low compression set which is retained at high service temperatures
- Stable and flexible over a wide temperature range
-
DOWSIL™ 3-8259 RF Silicone Foam
- Medium hardness (Shore 00)
- Reduced flow aids application to inclined surfaces
- User-friendly, easy to handle 1:1 mix ratio
- Fast ambient temperature cure, no need for temporary storage of equipped parts
- Low compression set which is retained at high service temperatures
- Stable and flexible over a wide temperature range
-
DOWSIL™ 7091 Adhesive Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Cures to a tough, flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
-
DOWSIL™ 7092 High Green Strength Adhesive and Sealant
- Provides Instant Green Strength
- Easy-to-use one-component adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Non-sag, paste consistency
- Cures to a tough, flexible rubber
- Stable and flexible form –50°C to +150°C
- UL 94 HB
- Fast strength build up supports productivity enhancements due to fast handling of bonded units
- Saves time as no buffer for strength build up required
-
DOWSIL™ 7093 Adhesive Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Low modulus for high movement capability
- Good adhesion to many substrates
- Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
-
DOWSIL™ 7094 Flowable Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy cure system
- Flowable and self-leveling
- Easy to apply
- Excellent unprimed adhesion to many substrates
- Stable and flexible from -50°C to +180°C
- Non-corrosive to metals
- Low odor
- Unprimed adhesion to various substrates
-
DOWSIL™ 730 FS Solvent Resistant Sealant
- One-component fluorosilicone adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Exposed to moisture in the air
- Acetoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Cures to a tough, flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -65°C (-85°F) to 260°C (500°F)
- Retains its properties under exposure to fuels, oils and solvents
-
DOWSIL™ 732 Multi-Purpose Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Acetoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Cures to a tough, flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
- Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
- Excellent dielectric properties
-
DOWSIL™ 734 Flowable Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Acetoxy cure system
- Flowable and self-leveling
- Easy to apply
- Cures to a tough, flexible rubber
- Fast tack-free time
- Good adhesion to many substrates
- Stable and flexible from -65°C (-85°F) to +180°C (+356°F)
- Excellent dielectric properties
-
DOWSIL™ 738 Electrical Sealant
- Non-flowing
- Room temperature cure, no ovens required
- High elongation for added stress relief
- No mixing required
- RT cure, no ovens required
- Faster in-line processing with optional heat acceleration
- Added reliability can result from lower cured stress
- Automated or manual needle dispense systems
