DOWSIL™ 1-4173 Thermally Conductive Adhesive

  • Fluid
  • Heat cure
  • Good thermal conductivity values
  • No added solvents
  • One-part – No mixing of separate components required
  • Rapid, versatile cure processing controlled by temperature
  • Able to flow, fill or self-leveling after dispensing
  • Heat flow away from PCB systems components can increase reliability

Additional information

Product Type
Brand
Technology
Base
Viscosity (mPa.s)
Color
Durometer hardness, Shore A
UL94
Certifications
Applications , , , ,
Number of components