DOWSIL™ TC-5026 Thermally Conductive Compound

  • Solvent-free formulation
  • Sliding
  • Does not polymerize
  • Able to achieve bond line thickness
  • Very low thermal resistance
  • High thermal conductivity
  • Wicks heat away from sensitive components

Additional information

Product Type
Brand
Technology
Dielectric strength (kV/mm)
Viscosity (mPa.s) , ,
Color
Curing
Thermal conductivity
Applications , , ,