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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Single-component solvent-based resin coating
- Room temperature cure, no ovens required
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional mild heat acceleration (after solvent flash-off) can speed in-line processing
- UV indicator allows for automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emissions recovery may be simplified for VOC's in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to tough, resilient, abrasion resistant surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional heat acceleration after solvent flash-off
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low Viscosity enhances flow and fill in narrow gaps and spaces
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DOWSIL™ 3-1944 RTV Coating
- One-part, No mixing required
- Good flowability
- Able to flow, fill or self-leveling after dispensing
- Faster in-line processing with optional heat acceleration
- No added solvents
- Allows use with many low-solids lead-free solder
- Improves reliability against stress
- UV indicator enables automatic inspection
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DOWSIL™ 3-1965 Conformal Coating
- No added solvents
- Room temperature cure, no ovens required
- Mild heat acceleration can speed in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating can improve reliability against stress
- Low viscosity enhances flow and fill in narrow gaps and spaces
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- 1-1 mix ratio
- Highly fluent
- Self-leveling
- Versatile cure processing controlled by temperature
- Provides heat flow away from circuitry components can increase reliability
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- No added solvents
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DOWSIL™ SE 9184 RTV Adhesive
- Fast tack-free RT cure
- Non-flowing
- Enhanced thermal conductivity
- Controlled silicone volatility
- No mixing required
- Room temperature cure, no ovens required
- Faster in line processing at RT with option for heat acceleration
- Can be considered for uses requiring added flame resistance and thermal dissipation
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
