Home »
V-0
Showing 1–20 of 22 results
Filters
-
DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Single-component solvent-based resin coating
- Room temperature cure, no ovens required
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
-
DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional mild heat acceleration (after solvent flash-off) can speed in-line processing
- UV indicator allows for automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emissions recovery may be simplified for VOC's in some U.S. states
-
DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to tough, resilient, abrasion resistant surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional heat acceleration after solvent flash-off
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low Viscosity enhances flow and fill in narrow gaps and spaces
-
DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Heat cure
- Good thermal conductivity values
- No added solvents
- One-part - No mixing of separate components required
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Heat flow away from PCB systems components can increase reliability
-
DOWSIL™ 3-1944 RTV Coating
- One-part, No mixing required
- Good flowability
- Able to flow, fill or self-leveling after dispensing
- Faster in-line processing with optional heat acceleration
- No added solvents
- Allows use with many low-solids lead-free solder
- Improves reliability against stress
- UV indicator enables automatic inspection
-
DOWSIL™ 3-1965 Conformal Coating
- No added solvents
- Room temperature cure, no ovens required
- Mild heat acceleration can speed in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating can improve reliability against stress
- Low viscosity enhances flow and fill in narrow gaps and spaces
-
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Good heat dissipation
- Avoids delamination problems
- Accelerated heat cure
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
-
DOWSIL™ SE 9184 RTV Adhesive
- Fast tack-free RT cure
- Non-flowing
- Enhanced thermal conductivity
- Controlled silicone volatility
- No mixing required
- Room temperature cure, no ovens required
- Faster in line processing at RT with option for heat acceleration
- Can be considered for uses requiring added flame resistance and thermal dissipation
-
DOWSIL™ SE 9189 L RTV
- Fast tack free, room temperature cure
- Flowable
- Cures to soft, low stress elastomer
- Controlled silicone volatility
- No added solvents
- Room temperature cure, no ovens required
- Faster in-line processing at room temperature with option for mild heat acceleration
- Soft coating can improve reliability against stress
- Can be considered for uses requiring flame resistance
-
DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
-
DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-part thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
