Dowsil electronics
Showing 21–40 of 47 results
Filters
-
DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Strong electromagnetic shielding across a wide range of frequencies
- Easy to dispense and cure at room temperature when exposed to moisture in air
- Unique Dow formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
-
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Good heat dissipation
- Avoids delamination problems
- Accelerated heat cure
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
-
DOWSIL™ SE 9184 RTV Adhesive
- Fast tack-free RT cure
- Non-flowing
- Enhanced thermal conductivity
- Controlled silicone volatility
- No mixing required
- Room temperature cure, no ovens required
- Faster in line processing at RT with option for heat acceleration
- Can be considered for uses requiring added flame resistance and thermal dissipation
-
DOWSIL™ SE 9189 L RTV
- Fast tack free, room temperature cure
- Flowable
- Cures to soft, low stress elastomer
- Controlled silicone volatility
- No added solvents
- Room temperature cure, no ovens required
- Faster in-line processing at room temperature with option for mild heat acceleration
- Soft coating can improve reliability against stress
- Can be considered for uses requiring flame resistance
-
DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
