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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
 - Good heat dissipation
 - Avoids delamination problems
 - Accelerated heat cure
 - Optimized processing time
 - Allows for the implementation of complex projects
 - No additional dielectric barrier required
 - Allows for quick filling
 - It is suitable for high-throughput production processes.
 - Filling allows easy control of the process
 - Meets certification requirements
 
 
				