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Home » Products » Dowsil electronics » DOWSIL™ 340 Heat Sink Compound
Home Dowsil electronics DOWSIL™ 340 Heat Sink Compound
DOWSIL™ 340 Heat Sink Compound

DOWSIL™ 340 Heat Sink Compound

  • Non-flowing
  • Moderate thermal conductivity
  • No need for ovens or curing
  • Heat flow away from circuitry components can increase reliability
Categories: Dowsil electronics, Thermally Conductive Adhesive Tag: Thermally Conductive Adhesive
  • Additional information

Additional information

Product Type Thermally Conductive Adhesive
Brand DOWSIL™
Technology Silicone
Base Zinc oxide, Polydimethylsiloxane
Viscosity (mPa.s) >500, 000 mPa.s
Color White
Thermal conductivity >0, 5 / <0, 7 W/m*K
Applications Connectors, Electronic Components

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      • Brand
        • Dow
          • Dowsil
          • Silastic
          • Sylgard
        • Bostik
        • Emax
        • Setral
        • Electrolube
      • Industrial Adhesives
        • Anaerobic adhesives
          • Threadlocking
          • Retaining
          • Pipe Sealing
          • Gasketing
        • Instant adhesives
          • Ultra Gel
          • Ultra
          • Structural
          • Repair
          • Light Lock
          • Flex
      • Specialty lubricants
        • Lubrificating oils
        • Lubrificating greases
        • Lubrificating pastes
      • Electronic Protection
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