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CUT-setral-CST 2/F
- H1 general purpose cleaner and degreaser
- Suitable for steel and nonferrous metals
- For production of food packagings of tin and aluminium
- Reduces wear and tear
- Evaporates quickly
- Nearly residue-free evaporation
- Free from heavy metals and their compounds
- Contains no chlorine
- Subsequent cleaning not necessary
- Food approval food institute Wuolf Bostel
- Paint compatible, suitable for water-based and solvent based paints
- Silicone-free
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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Single-component solvent-based resin coating
- Room temperature cure, no ovens required
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional mild heat acceleration (after solvent flash-off) can speed in-line processing
- UV indicator allows for automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emissions recovery may be simplified for VOC's in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to tough, resilient, abrasion resistant surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional heat acceleration after solvent flash-off
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low Viscosity enhances flow and fill in narrow gaps and spaces
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Heat cure
- Good thermal conductivity values
- No added solvents
- One-part - No mixing of separate components required
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Heat flow away from PCB systems components can increase reliability
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DOWSIL™ 1200 OS Primer
- Improves adhesion of silicone sealants to many substrates
- Provides more uniform and stronger bonds
- Conforms to South Coast and Bay Air Quality Management District Regulations for architectural sealant primers
- Architectural sealant primers
- Low VOC at 76 g/l
- Formulated for low toxicity
- OS solvent used does not deplete the ozone layer OS = Ozone Safe
- Primer is suitable for weathersealing and structural glazing applications
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DOWSIL™ 3-1944 RTV Coating
- One-part, No mixing required
- Good flowability
- Able to flow, fill or self-leveling after dispensing
- Faster in-line processing with optional heat acceleration
- No added solvents
- Allows use with many low-solids lead-free solder
- Improves reliability against stress
- UV indicator enables automatic inspection
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DOWSIL™ 3-1965 Conformal Coating
- No added solvents
- Room temperature cure, no ovens required
- Mild heat acceleration can speed in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating can improve reliability against stress
- Low viscosity enhances flow and fill in narrow gaps and spaces
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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Mechanical strength
- UV indicator for inspection
- Primerless adhesion
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- 1-1 mix ratio
- Highly fluent
- Self-leveling
- Versatile cure processing controlled by temperature
- Provides heat flow away from circuitry components can increase reliability
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- No added solvents
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DOWSIL™ 3-8219 RF Silicone Foam
- Medium hardness (Shore 00)
- Reduced flow aids application to inclined surfaces
- Easy to handle
- 1:1 mix ratio
- Fast ambient temperature cure
- No need for temporary storage of equipped parts
- equipped parts
- Low compression set which is retained at high service temperatures
- Stable and flexible over a wide temperature range
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DOWSIL™ 3-8259 RF Silicone Foam
- Medium hardness (Shore 00)
- Reduced flow aids application to inclined surfaces
- User-friendly, easy to handle 1:1 mix ratio
- Fast ambient temperature cure, no need for temporary storage of equipped parts
- Low compression set which is retained at high service temperatures
- Stable and flexible over a wide temperature range
