000 mPa.s
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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Single-component solvent-based resin coating
- Room temperature cure, no ovens required
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Solvent-borne resin coating
- Room temperature cure, no ovens required
- Optional mild heat acceleration (after solvent flash-off) can speed in-line processing
- UV indicator allows for automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emissions recovery may be simplified for VOC's in some U.S. states
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DOWSIL™ 3-1944 RTV Coating
- One-part, No mixing required
- Good flowability
- Able to flow, fill or self-leveling after dispensing
- Faster in-line processing with optional heat acceleration
- No added solvents
- Allows use with many low-solids lead-free solder
- Improves reliability against stress
- UV indicator enables automatic inspection
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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Mechanical strength
- UV indicator for inspection
- Primerless adhesion
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- 1-1 mix ratio
- Highly fluent
- Self-leveling
- Versatile cure processing controlled by temperature
- Provides heat flow away from circuitry components can increase reliability
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- No added solvents
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Good heat dissipation
- Avoids delamination problems
- Accelerated heat cure
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ Q3-3526 Base and Catalyst
- Fast handling of bonded components: develops adhesive strength rapidly at room temperature permitting fast handling of components
- Adheres to suitably prepared polypropylene
- Two-part system with 10:1 mix ratio by weight Noncorrosive, low odor cure
- Contains no solvents
- Non-slump nature when mixed, allows extruded bead to be maintained without flowing
- Excellent weathering, U.V. and heat resistance to 190°C
- Available in two color versions: Grey (RAL 7038) Black (RAL 7016)
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DOWSIL™ SE 9189 L RTV
- Fast tack free, room temperature cure
- Flowable
- Cures to soft, low stress elastomer
- Controlled silicone volatility
- No added solvents
- Room temperature cure, no ovens required
- Faster in-line processing at room temperature with option for mild heat acceleration
- Soft coating can improve reliability against stress
- Can be considered for uses requiring flame resistance
