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Home » Products » Dowsil electronics » DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
Home Dowsil electronics DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler

  • Room temperature cure
  • Long term performance stability during temperature cycling up to 150°C
  • Low compression stress
  • Holds vertical position (cured or uncured state)
  • Controlled silicone volatility
Categories: Dowsil electronics, Gap filler Tag: Gap filler
  • Additional information

Additional information

Product Type Gap filler
Brand DOWSIL™
Technology Silicone
Dielectric strength (kV/mm) 12
Viscosity (mPa.s) >250, 000 / <500, 000 mPa.s
Color Indifferent
Curing Cold
UL94 V-0
Thermal operating range ≤150 °C
Thermal conductivity >2 / >3 W/m*K
Applications Printed Circuit Board (PCB)

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      • Brand
        • Dow
          • Dowsil
          • Silastic
          • Sylgard
        • Bostik
        • Emax
        • Setral
        • Electrolube
      • Industrial Adhesives
        • Anaerobic adhesives
          • Threadlocking
          • Retaining
          • Pipe Sealing
          • Gasketing
        • Instant adhesives
          • Ultra Gel
          • Ultra
          • Structural
          • Repair
          • Light Lock
          • Flex
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        • Lubrificating oils
        • Lubrificating greases
        • Lubrificating pastes
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