In the advanced electronics sector, component protection is a strategic element in ensuring performance, durability and reliability. Exposure to thermal cycles, shocks, vibrations or contaminants can compromise the functional integrity of an electronic circuit or PCB board. In this context, silicone encapsulation materials are the go-to choice for designers, engineers and technicians working with critical devices or in harsh environments.
Silicone encapsulants and silicone gels are reliable, versatile and high-performance solutions that stand out for their dielectric properties, mechanical strength and thermal stability.
MD Poland, in collaboration with Dow, offers a complete portfolio of solutions for electronic encapsulation, with products from the DOWSIL™ and SYLGARD™ ranges, designed to meet the specific needs of different industrial sectors.
The advantages of silicone encapsulants over organic materials
Unlike epoxy or urethane-based solutions, silicone encapsulants offer numerous technical advantages:
- thermal stability over a wide temperature range (-45°C / +200°C);
- high elasticity to absorb thermal expansion without stressing the component;
- advanced protection against moisture, UV radiation and chemicals;
- excellent electrical insulation and dielectric properties;
- easy processability, even without primer and without exothermic reactions.
These characteristics make silicones ideal for critical environments, such as automotive, aerospace, industrial, lighting or telecommunications. It is no coincidence that Dow has been recognised for over 70 years as a global leader in the field of electronic encapsulants, with a range of over 7,000 tested and reliable silicone solutions.
Encapsulant or gel: how to choose the most suitable material
Silicone encapsulants: structural protection and resistance
Two-component addition-curing silicone encapsulants are formulated to provide durable mechanical protection. They are used when the following is required:
- a strong and durable structure;
- thermal management through conductive materials;
- adhesion to metal or plastic substrates, even without primer;
- complete insulation of the module, even in high thicknesses.
The DOWSIL™ range includes products for every need, from low-viscosity formulations for fast cycles to encapsulants with high Shore A hardness for aggressive environments.
Application examples:
- DOWSIL™ CN-8760 G: reworkable thermally conductive encapsulant.
- SYLGARD™ 160: elastomer with high thermal stability.
- DOWSIL™ SE 1816 CV: black encapsulant with long pot life.
Silicone gels: maximum stress relief and reworkability
Silicone gels are the ideal solution for applications requiring flexibility, self-healing properties and ease of use. Thanks to their viscoelastic nature, gels:
- absorb mechanical stress without transferring it to the component;
- adhere naturally to surfaces without the need for primers;
- allow reworking of the module;
- offer excellent dielectric properties.
Some examples:
- DOWSIL™ 3-4155 HV: dielectric gel for low temperatures down to -80°C
- SYLGARD™ 527: standard gel with high penetration
- DOWSIL™ EG-3000: thixotropic gel for selective protection
A portfolio designed for every application need
DOWSIL encapsulants and DOWSIL gels offer a wide range of:
- Viscosity (from 260 to 65,000 mPa·s).
- Hardness (from Shore 00 to Shore A >60).
- Flexible processing and curing times.
- Certifications (UL 94 V-0, MIL-SPEC, EN 45545).
Options are also available with:
- Rapid UV curing.
- High transparency for optical applications.
- Resistance to fuels and solvents.
- Compliance with space standards.
Thanks to the variety of chemical and physical characteristics, designers can choose the ideal material based on the PCB layout, process constraints and performance requirements over time.
Conclusion
Relying on silicone encapsulants means adopting proven technology to ensure durability and performance in any industrial context. MD Poland not only offers DOWSIL™ and SYLGARD™ products, but also dedicated technical support to help companies select the most suitable material for their specific application.
If you are considering an encapsulation or protection solution for electronics, contact the experts at MD Poland: we will guide you in choosing, testing and validating the best silicone gels and electronic encapsulants for your specific application.
