Additional information
| Product Type | Thermally Conductive Adhesive |
|---|---|
| Brand | DOWSIL™ |
| Technology | Silicone |
| Base | Heat-conductive filler Two-part silicone adhesive |
| Dielectric strength (kV/mm) | 18 |
| Viscosity (mPa.s) | <100, 000 mPa.s |
| Color | Gray |
| Curing | Hot |
| Thermal operating range | ≤200 °C |
| Thermal conductivity | >1 / >2 W/m*K |
| Applications | Printed Circuit Board (PCB), Thermal Interface |
