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UL 94 V0
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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Cures to tough, resilient, abrasion resistant surface
- Single-component solvent-based resin coating
- Room temperature cure, no ovens required
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Heat cure
- Good thermal conductivity values
- No added solvents
- One-part - No mixing of separate components required
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Heat flow away from PCB systems components can increase reliability
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DOWSIL™ 3-1965 Conformal Coating
- No added solvents
- Room temperature cure, no ovens required
- Mild heat acceleration can speed in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating can improve reliability against stress
- Low viscosity enhances flow and fill in narrow gaps and spaces
