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Thixotropic
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DOWSIL™ 7091 Adhesive Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Cures to a tough, flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
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DOWSIL™ 7092 High Green Strength Adhesive and Sealant
- Provides Instant Green Strength
- Easy-to-use one-component adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Non-sag, paste consistency
- Cures to a tough, flexible rubber
- Stable and flexible form –50°C to +150°C
- UL 94 HB
- Fast strength build up supports productivity enhancements due to fast handling of bonded units
- Saves time as no buffer for strength build up required
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DOWSIL™ 7093 Adhesive Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Low modulus for high movement capability
- Good adhesion to many substrates
- Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
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DOWSIL™ 730 FS Solvent Resistant Sealant
- One-component fluorosilicone adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Exposed to moisture in the air
- Acetoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Cures to a tough, flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -65°C (-85°F) to 260°C (500°F)
- Retains its properties under exposure to fuels, oils and solvents
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DOWSIL™ 732 Multi-Purpose Sealant
- One-part adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Acetoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Cures to a tough, flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
- Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
- Excellent dielectric properties
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DOWSIL™ 738 Electrical Sealant
- Non-flowing
- Room temperature cure, no ovens required
- High elongation for added stress relief
- No mixing required
- RT cure, no ovens required
- Faster in-line processing with optional heat acceleration
- Added reliability can result from lower cured stress
- Automated or manual needle dispense systems
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DOWSIL™ EA-3838 Fast Adhesive
- Fast and homogeneous cure in depth
- Early adhesion development at room temperature
- Non self-leveling, paste consistency
- Fast cure allows rapid handling of bonded components
- Fast assembly process
- Good, durable adhesion to a wide variety of substrates
- Excellent weathering and U.V. resistance
