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Thermally Conductive Adhesive
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- 1-1 mix ratio
- Highly fluent
- Self-leveling
- Versatile cure processing controlled by temperature
- Provides heat flow away from circuitry components can increase reliability
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- No added solvents
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DOWSIL™ SE 9184 RTV Adhesive
- Fast tack-free RT cure
- Non-flowing
- Enhanced thermal conductivity
- Controlled silicone volatility
- No mixing required
- Room temperature cure, no ovens required
- Faster in line processing at RT with option for heat acceleration
- Can be considered for uses requiring added flame resistance and thermal dissipation
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
