Additional information
| Product Type | Thermally Conductive Adhesive |
|---|---|
| Brand | DOWSIL™ |
| Technology | Silicone |
| Base | Silicone thermal conductive paste |
| Dielectric strength (kV/mm) | 2.29 |
| Viscosity (mPa.s) | <100, 000 mPa.s |
| Color | Indifferent |
| Thermal operating range | ≤200 °C |
| Thermal conductivity | >0, 7 / <0, 9 W/m*K |
| Applications | Printed Circuit Board (PCB), Thermal Interface |
