DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

  • Reduces pressure on components
  • Good heat dissipation
  • Avoids delamination problems
  • Accelerated heat cure
  • Optimized processing time
  • Allows for the implementation of complex projects
  • No additional dielectric barrier required
  • Allows for quick filling
  • It is suitable for high-throughput production processes.
  • Filling allows easy control of the process
  • Meets certification requirements

Additional information

Product Type
Brand
Technology
Dielectric strength (kV/mm)
Viscosity (mPa.s) , ,
Color
Curing
Gel Time
Elongation at break
UL94
Thermal conductivity (W/m.K) , ,
Thermal conductive , ,
Certifications