DOWSIL™ Silicone AP Adhesive Sealant

  • Cures at room temperature when exposed to moisture in the air
  • Acetoxy cure system
  • Non-sag, paste consistency
  • Easy to apply
  • Good adhesion to many substrates

Additional information

Product Type
Curing mechanism
Extrusion rate (g/min)
Color , , ,
Temp. min (°C)
Temp. max (°C)
Substrates , ,
Skin-over time (min)
Tack-Free Time (min)
Shore hardness
Elongation at break