One-part silicone
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Heat cure
- Good thermal conductivity values
- No added solvents
- One-part - No mixing of separate components required
- Rapid, versatile cure processing controlled by temperature
- Able to flow, fill or self-leveling after dispensing
- Heat flow away from PCB systems components can increase reliability
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Strong electromagnetic shielding across a wide range of frequencies
- Easy to dispense and cure at room temperature when exposed to moisture in air
- Unique Dow formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance