DOWSIL™ DA-6534 Adhesive

  • Low ionic impurities
  • Very high thermal conductivity
  • Contains silver filler
  • Good adhesion to Ni, Al, laminate, and silicon
  • Microelectronics grade material
  • Enables electrically conductive performance
  • Good adhesive performance for TIM1 or lid seal applications

Additional information

Product Type
Brand
Technology
Base
Viscosity (mPa.s)
Color
Durometer hardness, Shore A
Applications , ,
Number of components