7 W/m*K
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Good heat dissipation
- Avoids delamination problems
- Accelerated heat cure
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements