DOWSIL™ TC-6020 Thermally Conductive Encapsulant

  • Two-part thermal conductive encapsulant
  • Suitable for PCB system
  • Protection in harsh environmental and thermal conditions
  • Can be used at room temperature
  • Used in the production of electrical products, PCBs and modules
  • Good adhesion to aluminum
  • Excellent dielectric properties
  • Good smoothness
  • Easy dispensing
  • Good flexibility for easy processing
  • Good adhesion without the use of primer

Additional information

Product Type
Brand
Technology
Dielectric strength (kV/mm)
Viscosity (mPa.s) , ,
Color
Curing
Gel Time
Shore hardness ,
Elongation at break
UL94
Thermal conductivity (W/m.K)
Thermal conductive
Applications