DOWSIL™ CN-8760 Thermally Conductive Encapsulant

  • Low viscosity
  • Good thermal conductivity
  • Mixing ratio 1 to 1
  • Room temperature cure, no ovens required
  • Easy to mix and use
  • Good flowability for fast processing and short cycle times
  • Aids heat dissipation

Additional information

Product Type
Brand
Technology
Dielectric strength (kV/mm)
Viscosity (mPa.s) , ,
Color
Curing
Gel Time
Shore hardness ,
Elongation at break
UL94
Thermal conductivity (W/m.K) , , , , ,
Thermal conductive